공정1: 내층 I (재단, 내층노광/현상/부식/박리)
공정2 :내층II (BONDING, LAY-UP, PRESS LAMINATION) 1. Bonding (본딩) 레이업(적층) 작업을위해1차로내층회로가형성된 Thin Core CCL을Prepreg(층간접착제)와하나로맞붙이는
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