Transcription of PowerPAD Layout Guidelines - TI.com
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PowerPAD Layout Guidelines - TI.com
1 IntroductionLead frame(CopperAlloy)IC (Silicon)DieAttach (Epoxy)Lead frameDie Pad (or thermal pad)!ExposedAt Base of the PackageMoldCompound (Epoxy)ApplicationReportSLOA120 May2006 PowerPAD (TI) PowerPAD (PCB) , (orthermalpad)isexposedonthebottomoftheI C(seeFigure1).Thisprovidesanextremelylow thermalresistance( JC) May2006 PowerPAD ViaCopper , , (0,05mmwide) (s).2 PowerPAD LayoutGuidelinesSLOA120 or Spoke ViaNOT RecommendedSolidViaRecommendedExposedcop per! around viaTopCopperArea!makeas large as possibleSolder Mask Defined Thermal Pad!followdimensions givenBottommetalPlane!make aslarge as possibleThermal Vias -follow spacinggiven and keepdiameters less thanor equal to 0,3 ,3mmorless,andtherecommendedviaspacingis 1mm(seeFigure2andFigure4).
www .ti.com W eb or Spoke V ia NOT Recommended Solid V ia Recommended Exposed copper ! 0.05mm around via T op Copper Area ! make as large as possible
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