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Production Proven
3M Wafer Support SystemTemporary wafer bonding for advanced IC packaging High yields High throughput Cost effective Effectively handles wafers thinned to 20 mProductionProvenThe 3M Wafer Support System combines proprietary 3M temporary bonding technologies with world class equipment designed specifically to process wafers using 3M s wafer support system materials creating a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related the 3M Wafer Support System worksThe heart of the system is 3M Liquid UV- curable Adhesive a family of 100% solids acrylic adhesives designed for temporary bonding of semiconductor wafers to a glass carrier plate. This provides a rigid, uniform support surface that minimizes stress on the wafer during the subsequent processing steps, resulting in less warpage, cracking, edge chipping and higher Wafer Support SystemA Production - Proven solution for increasing the capability, yields and throughput of your 3D TSV Flow (Bonding)Wafer is supporte d on t he entire face and the CarrierUV -Cured Liquid AdhesiveBackgrindLineLTHCR eleaseLayerWafer Reliablemanufacturingultra-thin wafer&EffectiveMore1 Bond2 Backgrinding3 Backside processing4 Tape application5 Laser debonding6 Glass Carrier Lift-off7 Peel off UV adh
3M™ Light-to-Heat-Conversion Release Coating Glass Carrier Customer-supplied Semiconductor Wafer 3M™ LC-Series Liquid UV-Curable Adhesives Important Notice: Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated with such use.
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