QFN / DFN PCB 焊盤設計與焊接生產流程注意事項

1 QFN / DFN PCB 2 QFN/DFN PCB 3 QFN (Quad Flat No-Lead) / DFN (Dual Flat No-Lead) (Body size) (Lead pitch) I/O (Lead count) QFN/DFN PKG Body size (mm) Lead pitch (mm) Lead count picture 6 8 12 16 24 28 32 40 48 56 68 88 QFN 3x3 4x4 4x4 4x4 5x5 5x5 5x5 6x6 6x6 7x7 8x8 10x10 DFN 2x2 3x3 4 Cross-section : QFN/DFN COL (Chip On Lead) COL QFN/DFN Molding compound Bonding wire Lead I/O Die Die B-stage die attach epoxy adhesive Epoxy die attach Exposed pad I/O Exposed pad I/O Exposed pad QFN/DFN COL (Chip On Lead) Exposed pad 5 I/O , I/O QFN/DFN I/O , QFN/DFN ~ I/O , QFN/DFN I/O ( ) , , I/O QFN/DFN I/O 1:1, Solder bridging QFN/DFN I/O nominal ~ PCB QFN/DFN I/O ( ) I/O 6 PCB Land Pattern( QFN 5x5 DFN ) PCB QFN 5x5 Land Pattern DFN Land Pattern ZGE2D2 XYeCPLCPLGZE2D2 XeYSYMBOLS DESCRIPTION e Lead pad pitch X Lead pad width Y Lead pad length Z Outside pad terminal dimension G Inside pad terminal dimension CPL Distance between central pa

焊接允收判斷標準-QFN/DFN IPC-A-610規範8.3.13中， QFN/DFN系列產品焊接相關判斷標準如下表Table 8-15 。 適用class：class 2( 消費性電子產品適用)。 QFN/DFN 為無引腳設計，一般很難從其外觀的焊錫點來判斷其焊錫性是否良好，目前

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  Qfn dfn pcb

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