QFN / DFN PCB 焊盤設計與焊接生產流程注意事項

1 1 QFN / DFN PCB 2 QFN/DFN PCB 3 QFN (Quad Flat No-Lead) / DFN (Dual Flat No-Lead) (Body size) (Lead pitch) I/O (Lead count) QFN/DFN PKG Body size (mm) Lead pitch (mm) Lead count picture 6 8 12 16 24 28 32 40 48 56 68 88 QFN 3x3 4x4 4x4 4x4 5x5 5x5 5x5 6x6 6x6 7x7 8x8 10x10 DFN 2x2 3x3 4 Cross-section : QFN/DFN COL (Chip On Lead) COL QFN/DFN Molding compound Bonding wire Lead I/O Die Die B-stage die attach epoxy adhesive Epoxy die attach Exposed pad I/O Exposed pad I/O Exposed pad QFN/DFN COL (Chip On Lead) Exposed pad 5 I/O , I/O QFN/DFN I/O , QFN/DFN ~ I/O , QFN/DFN I/O ( ) , , I/O QFN/DFN I/O 1.

2 1, Solder bridging QFN/DFN I/O nominal ~ PCB QFN/DFN I/O ( ) I/O 6 PCB Land Pattern( QFN 5x5 DFN ) PCB QFN 5x5 Land Pattern DFN Land Pattern ZGE2D2 XYeCPLCPLGZE2D2 XeYSYMBOLS DESCRIPTION e Lead pad pitch X Lead pad width Y Lead pad length Z Outside pad terminal dimension G Inside pad terminal dimension CPL Distance between central pad to inside edge of lead pad (CPL minimum: ) D2 Thermal pad (Exposed pad) width E2 Thermal pad (Exposed pad) length 7 QFN / DFN PCB ( mm) HYCON QFN PCB IPC-7351 PCB Land dimensions PKG Body size Lead count e X Y Z G CPL D2 E2 QFN 3x3 16 4x4 24 4x4 28 4x4 32 5x5 32 5x5 40 5x5 48 6x6 48 6x6 56 7x7 56 8x8 68 10x10 88 8 QFN / DFN PCB ( mm) HYCON DFN PCB IPC-7351 PCB Land dimensions PKG Body size Lead count e X Y Z G CPL D2 E2 DFN * 6 EP 6 6 6 12 3x3 12 2x2 8 NSMD(Non-Solder Mask-Defined)

3 120 150 m 60 75 m *DFN COL (Chip On Lead) Exposed pad CPL D2 E2 9 PCB 1:1 20% , PCB ( mm) 50 90% QFN 8x8 QFN 4x4 10 PCB / QFN/DFN QFN/DFN (6mil) (5mil) (4mil) (3mil) IPC-7525 Stencil thickness PKG Lead pitch(mm) Stencil thickness QFN: 3x3 16L 4x4 24L 5x5 32L (5mil) DFN: 6L 6L 2x2 6L QFN: 4x4 28L (4mil) DFN: 3x3 12L QFN: 4x4 32L 5x5 40L 6x6 48L 7x7 56L 8x8 68L 10x10 88L DFN: 12L QFN: 5x5 48L 6x6 56L (3mil) 11 DFN , , type 3 (SN63/Pb37 or SAC alloy) Reflow profile Reflow profile , J-STD-020 ( ), PCB 12 12 IPC-A-610 IPC-A-610 SOT/SOP/LQFP Table 8-5 class class 2( ) -SOT/SOP/LQFP 13 13 (Maximum Side Overhang) (Minimum End Joint Width) (Minimum Side Joint Length) (Minimum Heel Fillet Height) IPC-A-610 A 50% W IPC-A-610 C 50% W IPC-A-610 D: L 3 W D 3 W 75% L IPC-A-610 D: L 3 W D 100% L (Lead Pitch) D IPC-A-610 F.

4 T F= G+ T T F= G+50% T -SOT/SOP/LQFP 14 -QFN/DFN IPC-A-610 QFN/DFN Table 8-15 class class 2( ) QFN/DFN QFN/DFN (In-Circuit-Te s t Function Test) X-ray 15 , , X-Ray QFN/DFN Leaf frame( ) IPC-A-610 ( Note 5 H ) : IPC-A-610 , , X-Ray : H - Not have solder coverage. 16 , , X-Ray 25% IPC-A-610 (Maximum Side Overhang) 25% ( A 25% W) : 25% X-Ray PCB PCB I/O - Maximum side overhang W>25% Not have solder coverage.

5 WA17 - , ( ) , X-Ray 75% IPC-A-610 (Minimum End Joint Width) 75% ( C 75% W) : 75% WCMinimum end joint width W<75% Not have solder coverage. 18 380 ~410 15~20 ( ) 5 l/min 2~3 ( 320 ~350 ) ( ) 19 380 ~410 3 ( 320 ~350 ) 20 / / / PCB ( / 90 ~120 ) / / ( / 320 ~350 ) / / ( / / 380 ~410 ) / / IC ESD EOS / 21 - : 22 IC.

6 23 IPC-7351 5 panels IPC-7351 5 panels PCB profile(JSTD020) PCB , PCB profile(JSTD020) , , , profile(JSTD020) - : 24 Thank you