Transcription of QFN PKG Tape
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QFN PKG Tape
qfn pkg Tape ( INNOSEM : PS series) 2014. 01 Production Technology Group World Best INNOX Production Technology Group Item PKG Process Lead frame Taping D/A (200 C x 90min) W/B (200 C x 30min) Mold (175 C x 2min) Detaping (RT) Suggestion qfn pkg Process 03B, 03D grade available Good Mold Bleed Applicable of PS Series 05F grade available Wire bonding stable to high modulus 05D grade available Stability of Residue World Best INNOX Production Technology Group Feature of PS Series Tape Structure High Heat Resistance using by PI Base Film & Silicone Adhesive To prevent attachment of particles in a heat process Low Unwinding Force due to using Fluoro-Silicone Treated Cover Film Minimum Contamination of Leadframe by Adhesive Residue Adhesive Layer (5~10 2 ) PI Film (25 2 ) Release PET Film (38, 50 2 )
“World Best INNOX” Production Technology Group Item Unit INNOX (PS Series) Test 05D 05F 03B 03D Method Base film - 25㎛ PI film Adhesion Thickness ㎛ 5 5 10 10 Micrometer Adhesion
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