QFN PKG Tape

1 qfn pkg Tape ( INNOSEM : PS series) 2014. 01 Production Technology Group World Best INNOX Production Technology Group Item PKG Process Lead frame Taping D/A (200 C x 90min) W/B (200 C x 30min) Mold (175 C x 2min) Detaping (RT) Suggestion qfn pkg Process 03B, 03D grade available Good Mold Bleed Applicable of PS Series 05F grade available Wire bonding stable to high modulus 05D grade available Stability of Residue World Best INNOX Production Technology Group Feature of PS Series Tape Structure High Heat Resistance using by PI Base Film & Silicone Adhesive To prevent attachment of particles in a heat process Low Unwinding Force due to using Fluoro-Silicone Treated Cover Film Minimum Contamination of Leadframe by Adhesive Residue Adhesive Layer (5~10 2 ) PI Film (25 2 ) Release PET Film (38, 50 2 )

2 World Best INNOX Production Technology Group Item Unit INNOX (PS Series) Test Method 05D 05F 03B 03D Base film - 25 PI film adhesion Thickness 5 5 10 10 Micrometer adhesion Strength RT gf/50mm 100 240 220 900 ASTM D3330 After heating (220 C/1hr) 250 400 300 1,200 Out-gassing % by TGA at. 200 C Wire Bondability - Good Good Good Good by Customer Mold Bleed Visual Inspect n INNOX Molding M/C Normal Good Good Good - Heat Resistant (Residue) Not allowed Excellent Good Good Good INNOX Method Tensile Strength MPa >180 >180 >180 >180 UTM Elongation % >50 >50 >50 >50 Modulus (at 150 C) Gpa DMA 50~100 C ppm 16 16 16 16 TMA 100~200 C 19 19 19 19 Key Typical Properties of PS Series for qfn pkg World Best INNOX Production Technology Group ITEM INNOX PS Series 38 Cu Foil Compet.

3 - A (ppm) 50~100 C 16 18 22 100~200 C 19 20 23 Test Condition . The CTE of INNOX s Tape is more similar to Cu Lead Frame Lower Warpage than Competitor s at High Temp. PS Series Tape Advantage Measuring Length change PI Film Fixed Zig Initial Load : 5g Specimen : Length 20mm Width 5mm P#1 test result by each materials World Best INNOX Production Technology Group P#2 Mold bleeding mechanism for qfn pkg Adhesive Lead Frame Surface Roughness PI Film QFN Tape Adhesive Lead Frame PI Film EMC Mold bleed good Adhesive Lead Frame PI Film Bad mold bleed Tape adhesion and wettability good Bad tape adhesion and wettability World Best INNOX Production Technology Group Taping Molding EDX Analysis P#3-1 Residue Test Method (SEM/EDX)

4 Item Residue Test Taping INNOX PS Series 05D, 05F, 03B, 03D L/F type Cu Molding condition 190 C X 2min Measurement machine Carl Zeiss Sigma SEM/EDX Measurement area L/F Pad Residue Test method Residue Test step World Best INNOX Production Technology Group P#3-2 Residue Test Results (SEM/EDX) Test method INNOX (PS Series) 05D 05F 03B 03D Microscope images Atomic Weight (%) C C C C O O O O Si Si Si Si Cu Cu Cu Cu No Silicone residue on the surface of L/F after molding. World Best INNOX Production Technology Group P#4 Cu Lead Frame Taping of PS Series Effect : Bubble and mold bleed is good Tape adhesion and wettability good Adhesive Lead Frame Surface Roughness PI Film QFN Tape Adhesive Lead Frame PI Film adhesion increases High-temperature coating process High-temperature Effect : Sticky and out gas is good World Best INNOX Production Technology Group P#5 Storage condition Guarantee period The guarantee period is 12 months after the date of manufacture when kept hermetically sealed and stored under the following condition without direct sunshine.

5 Temp. : 22 7 C, Humidity : below 60% RH