Transcription of Quad Flat Package (QFP) - Mouser Electronics
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Freescale Semiconductor, Inc., 2011-2014. All rights reserved. Freescale SemiconductorApplication NoteAN4388 Rev. , 2/20141 IntroductionThis document provides guidelines for handling and assembly of Freescale QFP packages during Printed Circuit Board (PCB) for PCB design, rework, and Package performance information such as Moisture Sensitivity Level (MSL) rating, board level reliability, mechanical and thermal resistance data are included for document contains generic information that encompasses various Freescale QFP packages assembled internally or at external subcontractors.
3.1 Package Description The QFP is a surface mount integrated circuit package. The st andard form is a flat rectangular body, usually square, with leads extending from all four sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. Standard Pb-free lead finish is Matte Tin.
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