Transcription of Reflow Soldering Profile, Per J-STD-020D, Table 5-2, …
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February 2019 Diodes Incorporated US: +1-408-232-9100 TW: +886-3-4518888 Reflow All specifications are subject to change without notice. Diodes Incorporporated A product Line ofDiodes IncorporatedProfile FeatureSn-Pb Eutectic AssemblyPb-Free AssemblyPreheat/SoakTemperature Min (Tsmin)Temperature Max (Tsmax)Time (ts) from (Tsmin to Tsmax) 100 C150 C60 -120 seconds150 C200 C60 -120 secondsRamp-up rate (TL to TP)3 C/second C/second temperature (TL)Time (tL) maintained above TL183 C60 -150 seconds217 C60 -150 secondsTime (tp)* within 5 C of the specifiedclassification temperature (Tc)**, seeReflow Soldering Profile * seconds30* secondsRamp-down rate (Tp to TL)6 C/second C/second 25 C to peak temperature6 minutes minutes max. * Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. IPC-020d-5-1 Tc -5 CtMax.
All specifications are subject to change without notice. REFLOW Rev E 07/18/12 SaRonix-eCera™ is a Pericom® Semiconductor company • US: +1-408-435-0800 TW: +886-3-4518888 • www.pericom.com
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