RSF/RSMF Series Stackpole Electronics, Inc.

Rev Date: 02/08/2018 2 www.seielect.com This specification may be changed at any time without prior notice marketing@seielect.com Please confirm technical specifications before you order and/or use.

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Current Sense and Thin Film Resistors - seielect.com

OAR. Surface Mount <0.0005. Current Sense and Thin Film Resistors www.seielect.com IRC/TT-LRMAP TCR (ppm/ºC)

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CF / CFM Series Stackpole Electronics, Inc.

Stackpole Electronics, Inc. Resistive Product Solutions Power Derating Curve: Recommended Solder Profiles This information is intended as a reference for solder profiles for Stackpole resistive components. These profiles should be compatible with most soldering processes. These are only recommendations. Actual numbers will depend on board

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RMCS1210 400 0.33 200 Maximum Working Maximum …

Ohmic Range (Q) and Tolerance 1 - 9.76 10 - 1M 1 - 9.76 10 - 1M RMCS2010_-HP 1 200 400 1 - 9.76 10 - 1M RMCS1210_-HP 0.75 200 400 1 - 9.76 10 - 1M RMCS1206_-HP 0.5 200 400 RMCS0805_-HP 0.33 150 300 1 - 9.76 10 - 1M RMCS0603_-HP 0.25 75 150 10 - 1M RMCS0402_-HP 0.1 50 100 1 - 9.76 Type/Code Power Rating (W) @ 70ºC Maximum Working …

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CSS / CSSH Series ± 50 - 0.001 - 0.003 ± 15 0.007 - 0.1 0 ...

Rev Date: 11/16/2021 1 www.seielect.com This specification may be changed at any time without prior notice. marketing@seielect.com Please confirm technical specifications before you …

Electrical Specifications - seielect.com

200 400 Type / Code Mil Ref Power Rating (W) @ 70ºC TCR (ppm/ºC) Maximum Overload Voltage (Vrms) RNF2 - 2 RNF12 RN 60 RNF1 RN 65--1 - 2.2M ... is Vp (lp, Pp) Note 4: Pulse limiting voltage (current, wattage) is applied at less than rated ambient temperature. If ambient temperature is more than the rated temperature (70 °C), decrease power ...

RMCF / RMCP Series RMCF2010 0.75 200 ... - Wirewound …

• Power derating from 100% at 70ºC to zero at +155ºC • AEC-Q200 compliant (except RMCP0201) ... Jumper Current (A) RMCF01005 0.03 15 30 0.5 0.05 25 50 200 400 3 150 (1) Lesser of or maximum working voltage ... If repetitive pulses are applied to resistors, pulse wave form must be less than “Pulse limiting voltage”, “Pulse limiting ...

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Type / Code Working Overload RSF12 Power Rating 9.00 ± 1 ...

General Purpose Metal Oxide Resistor Stackpole Electronics, Inc. ... • Lower-cost alternative to carbon comps and wirewounds • Coating meets UL 94V-0 • Meets solvent test of Mil Standard 202, Method 215 • Cut and formed product is available on select sizes - contact Stackpole ... B max Tape Unit 2.736 13.504 0.197 ± 0.020 2.063 ± 0 ...

  Unit, Metal, Coating

±50 100K - 100M 100K - 100M ±25 1M - 100M 1M - 100M …

Code Description Code W Code Tol Code Description Size Quantity Code ppm 0603 0.06 B 0.1% 0603, 0805 5000 E 25 0805 0.2 C 0.25% 1206 4000 C 50 HVCG Wire bondable (gold) 1206 0.33 D 0.5% 2010 4000 D 100 10 Kohm = 10K0 Solderable single surface 2010 1 F 1% 2512 2000 L 200 1 Mohm = 1M00

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RNCF Series ± 15 24.9 - 499K 4.7 - 1M Stackpole ...

Precision Thin Film Chip Resistor Stackpole Electronics, Inc. Resistive Product Solutions ... High Temperature Exposure MIL-STD-202 Method 108 +155°C for 1000 hours ... Low Temperature Operation JIS-C-5201-1 4.36 1 hour, - 65°C, followed by …

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GENERAL DESCRIPTION

when designing PCB’s which may be subject to high levels of board flexure. APPLICATIONS High Flexure Stress Circuit Boards • e.g. Depanelization: Components near edges of board. Variable Temperature Applications • Soft termination offers improved reliability performance in applications where there is temperature variation. • e.g.

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PCB Design Tutorial - AlternateZone.com

nice Printed Circuit Board (PCB) design. For some designers, the PCB design will be a natural and easy extension of the design process. But for many others the process of designing and laying out a PCB can be a very daunting task. There are even very experienced circuit designers who know very little about PCB design,

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Layout Design Guide - Toradex

start designing a carrier board. Please use this document together with the design guide of the appropriate Toradex computer module family and the datasheet of the module. 1.2 Additional Documents 1.2.1 Apalis Carrier Board Design Guide This document provides additional information to the schematic design of a carrier board for the Apalis modules.

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High-Speed Layout Guidelines for Signal Conditioners and ...

PCB manufacturing, layout, and design. 1.2 Critical Signals A primary concern when designing a system is accommodating and isolating high-speed signals. As high-speed signals are most likely to impact or be impacted by other signals, they must be laid out early

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Design Guide and Example of Stencil for Exposed Pad

PCB Cu Package Figure 1. Presence of standoff with gull wing package Stencil for flat lead package ... conditions must be taken into account when designing circuits for mass production. The technical information specified herein is intended only to show the typical functions of and

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The EAGLE Schematic & PCB Layout Editor - A Guide

This guide assumes that you are designing a two-sided PCB with plated-through holes (PTH), the normal case, and supported by the freeware version of EAGLE providing your board is no larger than 100mmX80mm. If you want to download the freeware EAGLE to your own PC this is easy. Look for the latest freeware version for your operating system ...

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Designing PCB LPs - wa5vjb.com

Designing PCB Log Periodic Antennas Kent Britain WA5VJB Over the last few years, I have developed many PCB Log Periodic antennas from 400 MHz to 11 GHz. I wish I could say I have a secret design process, but there were many variations and small pieces of metal tape on the early models. And while there are software programs such as IE3D and HFSS

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Designing a PCB - Stanford University

Designing a PCB • Design the schematic • Select the components • Place components on PCB • Route signals and power planes • Send design to manufacturer • Assemble

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Chiplets and Heterogeneous Packaging Are Changing System ...

Chiplets and Heterogeneous Packaging Are Changing System Design and Analysis www.cadence.com 4 f High-performance 3D die stacking techniques for better integration with the chip system and power/performance integration f Accelerated speed f Lower development cost offered by modular integration f Lower manufacturing costs by purchasing known-good die …

VRF SYSTEMS

• Advanced PCB Cooling. Improved cooling performance of the inverter . PCB by using liquid refrigerant instead of heat . sink cooling methods. • LG Inverter Scroll. Innovative high side-shell design creates a more . compact unit providing the same capacity output, with greater reliability in cold climates. • HiPOR™ (High-Pressure Oil ...