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Semiconductor Manufacturing Equipment

SemiconductorManufacturingEquipmentUSITC Publication 3868 June 2006 OFFICE OF International Trade CommissionWashington, DC 20436 UNITED STATES INTERNATIONAL TRADE COMMISSIONThis report was prepared principally byHeather Sykes and Falan Yinugunder the direction ofMichael Anderson,Chief, Advanced Technology and Machinery DivisionRobert Carr,Chief, Natural Resources and Metals DivisionAddress all communications toSecretary to the CommissionUnited States International Trade CommissionWashington, DC 20436 COMMISSIONERSS hara L. Aranoff, Vice ChairmanDaniel R. Pearson, ChairmanJennifer A. HillmanStephen KoplanDeanna Tanner OkunCharlotte R. A. RogowskyDirector of OperationsKaren Laney-CummingsDirector of Industries 1 The information and analysis provided in this report are for the purpose of this report in this report should be construed to indicate how the Commission would find in aninvestigation conducted under statutory authority covering the same or similar subject 1991, the United States International Trade Commission ini

producers, and customs treatment. Also included is an analysis of the basic factors affecting trends in consumption, production, and trade of the commodity, as well as those bearing on the competitiveness of U.S. industries in domestic and foreign markets. This report on semiconductor manufacturing equipment covers the period 2001 through 2005.

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