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Semiconductor Packaging Assembly Technology
Semiconductor , Packaging , Assembly Semiconductor Packaging Assembly Technology Literature Number: SNOA286. Semiconductor Packaging Assembly Technology August 1999. Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes New Technology Introduction And used by National Semiconductor to assemble IC devices in electronic packages. Electronic Packaging provides the in- Verification terconnection from the IC to the printed circuit board (PCB). Before implementing a new Technology , either a material or Another function is to provide the desired mechanical and an Assembly Technology , National Semiconductor utilizes a environmental protection to ensure reliability and perfor- rigorous system to characterize and verify the suitability of mance. Three fundamental Assembly flow processes (Table the change for high-volume production.)
Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in
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