Transcription of Semiconductor Packing Methodology (Rev. C)
{{id}} {{{paragraph}}}
Example: marketing
Semiconductor Packing Methodology (Rev. C)
Application ReportSZZA021C September 20051 Semiconductor Packing MethodologyCles Troxtell, Bobby O Donley, Ray Purdom, and Edgar ZunigaStandard Linear & LogicABSTRACTThe Texas Instruments Semiconductor Group uses three Packing methodologies to preparesemiconductor devices for shipment to end users. The methods employed are linked to thedevice level for shipping configuration keys. End users of the devices often need to perusemany TI and industry publications to understand the shipping configurations. This applicationreport documents TI s three main shipping methods and typical dimensions for end users.
SZZA021C Semiconductor Packing Methodology 3 Introduction This application report describes in detail the methods used by the TI Standard Linear & Logic
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
3 Methodology, 3 Research design and methodology, 3 Research design and methodology 3, Methodology, CHAPTER 3 Research methodology, CHAPTER 3 Research methodology 3, A comprehensive methodology to qualify the, A comprehensive methodology to qualify the reliability, 3 Texas Instruments, Case Study Methodology, Case study, QuEChERS Methodology: AOAC Method