Transcription of Shelf-Life Evaluation of Lead-Free Component Finishes
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Shelf-Life Evaluation of Lead-Free Component Finishes
Application ReportSZZA046 - June 20041 Shelf-Life Evaluation of Lead-Free Component FinishesDouglas W. Romm, Donald C. Abbott, and Bernhard LangeABSTRACTThe integrated circuit (IC) industry is converting to lead (Pb)- free termination Finishes forleadframe-based packages. IC Component users need to know the maximum length of timethat components can be stored prior to being soldered. This study predicts shelf life of theprimary Pb- free Finishes being proposed by the industry. Components were exposed to acontrolled environment, with known aging acceleration factors. The Pb- free componentswere exposed to a Battelle Class 2 environment both in and outside of their normal packingmaterials. Results show that the Pb- free -finished ICs stored in tubes, trays, or tape-and-reelpacking material pass solderability testing after 96-h exposure to the Class 2 exposure correlates to eight years in an uncontrolled indoor environment, such as.
SZZA046 Shelf-Life Evaluation of Lead-Free Component Finishes 5 Procedure To study shelf life by solderability testing of surface-mount ICs, a Battelle Class 2 MFG
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