Transcription of SMA Application Guideline - passive component
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SMA Application Guideline - passive component
Walsin Technology Corporation Version 03 Page-1 Lead Free MLCC, Chip-R, MLCI SMA Application Guideline Walsin Technology Corporation Version 03 Page-2 Background Pb free solder material was started in 1995. A composition of ( ) was announced in July 1998, though, since later it was found that for 42 alloy (most popular material fore lead frame), wetting and joint strength was insufficient and further Life-off problem was newly found, the composition was reviewed and resulted in the present composition. According to the test data shown in that meeting, major components (QFP, Chip-R, MLCC) were tested and significant difference in mechanical strength was not found compared with Sn/Pb solder. Some of Japanese electronic equipment providers may think technical problems were to some extent cleared.
Walsin Technology Corporation HTTP://WWW.PASSIVECOMPONENT.COM Version 03 Page-1 Lead Free MLCC, Chip-R, MLCI SMA Application Guideline
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