Transcription of Solder Paste—Tack Test
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Solder Paste—Tack Test
ScopeThis test is to determine the ability of a printedpattern of Solder paste to retain a probe placed in the solderpaste by measuring the force required to separate the probefrom the paste. Time between printing and probe placementare progressively increased to simulate variables in a manu-facturing Applicable Test SpecimenA representative sample of this pasteshould then be printed out, using a stencil, onto clean plain-glass slides. At least six paste deposits should be printed perrequired time data-point. The final deposits must be circular, mm in diameter and mm thick. Mark the test speci-men in a suitable manner to identify the sample and the timeafter printing when tackiness is to be measured. The preparedsamples shall be stored at 25 C 2 C and 50 C 10% rela-tive humidity (RH) until evaluated. The samples shall not bestored in an enclosed cabinet or container, which allows thesolder paste solvent vapors to saturate the environment sur-rounding the printed paste, thus preventing natural drying ofthe Equipment/ApparatusA Chatillon tackiness tester orother equipment may be used, providing it is capable of accu-rately measuring force when tested at a similar velocity.
1.0 Scope This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste.
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