Transcription of Solder Paste—Wetting Test - IPC
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Solder Paste—Wetting Test - IPC
The Institute for Interconnecting and Packaging Electronic Circuits Number 2215 Sanders Road Northbrook, IL 60062-6135 Subject Solder Paste wetting Test Date Revision 1/95. IPC-TM-650 Originating Task Group TEST METHODS MANUAL Solder Paste Task Group (5-24b). Scope Determine the ability of a Solder paste to wet an Reflow using the procedure outlined in paragraph oxidized copper surface and to qualitatively examine the of IPC-TM-650, Test Method amount of spatter of the Solder paste during reflow. After reflow, the residual flux shall be removed with a Applicable Documents None suitable solvent. IPC-TM-650 Test Methods Manual Evaluation When examined visually at 10X, the Solder Solder Paste Solder Ball Test shall uniformly wet the copper and there should be no evi- dence of dewetting or non- wetting of the copper and there Test Specimen shall be no Solder spatter around the printed dots.
1.0 Scope Determine the ability of a solder paste to wet an oxidized copper surface and to qualitatively examine the amount of spatter of the solder paste during reflow. 2.0 Applicable Documents None IPC-TM-650 Test Methods Manual
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