Transcription of SOT23 - NXP
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SOT23 - NXP
SOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm body9 January 2017 Package information1. Package summaryDimensions (mm) x x 1 Terminal position codeD (double)Package type descriptive codeTO-236 ABPackage outline version codeSOT23 Manufacturer package codeSOT23 Package type industry codeTO-236 ABPackage outline version descriptionplastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodyPackage style descriptive codeSOT (small outline transistor)Package body material typePJEDEC package outline codeTO-236 ABHandling precautionsIC26_CHAPTER_3_2000 Thermal design considerationsSC18_1999_CHAPTER_5_2 Mounting method typeS (surface mount)Generic mounting and soldering informationAN10365_3 Reflow soldering footprintSOT023_frWave soldering footprintSOT023_fwPackage life cycle statusRELM ajor version date18-9-2008 Minor version date6-7-2012 Security statusCOMPANY PUBLICM odified date28-11-2012 Issue date16-3-2006 Web publication date28-11-2012 Initial web publication date11-3-2011 Customer specific indicatorNMaturityProductPackage authorNair DeepaPackage approverNair DeepaTable 1.
Wave soldering footprint SOT023_fw Package life cycle status REL Major version date 18-9-2008 Minor version date 6-7-2012 Security status COMPANY PUBLIC Modified date 28-11-2012 Issue date 16-3-2006 Web publication date 28-11-2012 Initial web publication date 11-3-2011 Customer specific indicator N
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