Transcription of SOT89 - NXP
{{id}} {{{paragraph}}}
SOT89 SOT89plastic surface-mounted package; die pad for good heattransfer; 3 leads8 February 2016 Package information1. Package summaryTerminal position codeS (single)Package type descriptive codeSOT89 Package type industry codeSOT89 Package style descriptive codeSOT (small outline transistor)Package style suffix codeNA (not applicable)Package body material typeP (plastic) jedec package outline codeTO-243 JEITA package outline codeSC-62 Mounting method typeS (surface mount)Issue date29-8-2006 Table 1. Package summarySymbolParameterMinTypNomMaxUnitDp ackage quantity of termination--3- NXP SemiconductorsSOT89plastic surface-mounted package; die pad forgood heat transfer; 3 leadsSOT89 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016. All rights reservedPackage information8 February 20162 / 52.
JEDEC package outline code TO-243 JEITA package outline code SC-62 Mounting method type S (surface mount) ... 3.95 4.6 1.5 1.5 Dimensionsinmm Fig. 2. Reflow soldering footprint for SOT89 solderlands solderresist ... to the publication hereof. NXP Semiconductors SOT89
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}