Transcription of SOT89 - NXP
1 SOT89 SOT89plastic surface-mounted package; die pad for good heattransfer; 3 leads8 February 2016 Package information1. Package summaryTerminal position codeS (single)Package type descriptive codeSOT89 Package type industry codeSOT89 Package style descriptive codeSOT (small outline transistor)Package style suffix codeNA (not applicable)Package body material typeP (plastic) jedec package outline codeTO-243 JEITA package outline codeSC-62 Mounting method typeS (surface mount)Issue date29-8-2006 Table 1. Package summarySymbolParameterMinTypNomMaxUnitDp ackage quantity of termination--3- NXP SemiconductorsSOT89plastic surface-mounted package; die pad forgood heat transfer; 3 leadsSOT89 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016. All rights reservedPackage information8 February 20162 / 52.
2 Package outlineREFERENCESOUTLINEVERSIONEUROPEANP ROJECTIONISSUEDATEIECJEDECJEITADIMENSION S(mmaretheoriginaldimensions)SOT89TO-243 SC-6206-03-1606-08-29wMe1eEHEBB024mmscal ebp3bp2bp1cDLpAPlasticsurface-mountedpac kage;exposeddiepadforgoodheattransfer; 1. Package outline SOT89 NXP SemiconductorsSOT89plastic surface-mounted package; die pad forgood heat transfer; 3 leadsSOT89 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016. All rights reservedPackage information8 February 20163 / 53. (3 ) (3 ) (3 ) (2 ) 2. Reflow soldering footprint for (2 ) (2 ) 3. Wave soldering footprint for SOT89 NXP SemiconductorsSOT89plastic surface-mounted package; die pad forgood heat transfer; 3 leadsSOT89 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016.
3 All rights reservedPackage information8 February 20164 / 54. Legal informationDisclaimersLimited warranty and liability Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an informationsource outside of NXP no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence)
4 , warranty, breach ofcontract or any other legal any damages that customer might incur for any reasonwhatsoever, NXP Semiconductors aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP to make changes NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication SemiconductorsSOT89plastic surface-mounted package; die pad forgood heat transfer; 3 leadsSOT89 All information provided in this document is subject to legal disclaimers. NXP Semiconductors 2016. All rights reservedPackage information8 February 20165 / 55.
5 Contents1. Package 12. Package 23. 34. Legal 4 NXP Semiconductors 2016. All rights reservedFor more information, please visit: sales office addresses, please send an email to: of release: 8 February 2016
