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Stencil Design Guidelines for Electronics Assembly ...
BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICSDEPARTMENT OF Electronics TECHNOLOGYS tudent professional contest The 22nd Edition, Brasov,24th-27th April 2013 Stencil Design Guidelines forElectronics Assembly TechnologiesREFLOW SOLDERING - MATERIALO. Krammer: Stencil manufacturing and designSolder paste is a combination of pre-alloyed spherical metal powder andflux pastePacking of solder pastes: jar and syringeSolder pastehttp://engw Senj u2/44 REFLOW SOLDERING TECHNOLOGYThe reflow soldering technology basicallyconsists of three steps:1. deposition of the solder pasteby dispensing (topic )or by Stencil printing2. placement of the componentspick&place, collect&place,3. remelting the solder alloy in the solder paste usually in an Krammer: Stencil manufacturing and designSurface mounted resistor3/44 REFLOW SOLDERING TECHNOLOGYO. Krammer: Stencil manufacturing and design4/44 The reflow soldering technology basicallyconsists of three steps:1.
- Alloy of the solder bump is eutectic (Sn63Pb37, SAC305, SAC387) - Material of the package is epoxy - Interposer is FR4 or BT (Bismaleimide Triazin) - Higher CTE mismatch to silicon, lower reliability (FR4, BT CTE ~14-18 ppm/°C) • CBGA – Ceramic Ball Grid Array - Alloy of the solder bump generally is non-eutectic
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