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Moisture-SensitivityClassificationofFlan ge-MountedPackagesatTexasInstrumentsAppl icationReportLiteratureNumber:SLZA002 September20072 SLZA002 September2007 SubmitDocumentationFeedback1 IntroductionApplicationReportSLZA002 (MSL)offlange-mountedpackagesisperformed usingtheJointIndustryStandardIPC/J-STD-0 20 Cguidelinesforsurfacemounttechnology(SMT ) ,QFPorTSOP;flange-mountedandSMTpackagesw ithexposeddiepaddle(seeFigure1), PackageExposed Die Paddle PackageDie paddle/Die size ratioBond Line ThicknessSmaller Die PaddleLarge Die PaddleThick Bond Line ThicknessThin Bond Line ThicknessDie Paddle FinishIncrease in Die Paddle ,leadframefinish,materialselection,andas semblyprocessvariations(bondlinethicknes s,curingprofile,filletheight,etc). ,delaminationatthisinterfaceareacouldbea majorreliabilityproblem, , , ,thesilicondie,andthemoldcompound, ( 65to150 C) (wirestitchlocationisalsoafactor). hard connectedtothediepaddle, (MSL)offlange- : (beforesubmittingtheunitstotheactualtest ).
Moisture-SensitivityClassification of Flange-MountedPackages at Texas Instruments Application Report Literature Number: SLZA002 September 2007
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