Transcription of SURFACE MOUNT NOMENCLATURE AND …
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SURFACE MOUNTNOMENCLATUREAND PACKAGINGTel 800-776-9888 Email 4 MELF Tantalum .12 Transistors and 14 Lead 27 (Ball Grid Array)..36 Flip Pitch booklet is a plain-English introduction to SURFACE MOUNT nomenclatureand packaging. Soon you will be speaking the language of SURFACE Mountjust like a NomenclatureThere are many different types of SURFACE MOUNT packages. Each time anew SURFACE MOUNT package is developed a new name is created. Thesenames are usually abbreviated by their initials. As an example: The QuadFlat Pack is commonly known as the QFP. Unfortunately, some packageshave more than one name. This sometimes creates confusion in theindustry. I will do my best to explain the subtle dif ferences betweencomponent Package versus PackagingLet's start by clarifying the difference between the words "package(s)" and"packaging.
3 OVERVIEW This booklet is a plain-English introduction to surface mount nomenclature and packaging. Soon you will be speaking the language of Surface Mount
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Chip Ball Grid Array Package Reference Guide, MSC8256, MSC8256 package ball grid array, MicroStar BGA Packaging Reference Guide, MicroStar BGA Packaging Reference Guide Texas Instruments, Package, Guide, ASSOCIATION CONNECTING ELECTRONICS, ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES, RF Agile Transceiver Data Sheet AD9363, Analog, Analog Devices