Transcription of SURFACE MOUNT NOMENCLATURE AND PACKAGING
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SURFACE MOUNT NOMENCLATURE AND PACKAGING
SURFACE MOUNTNOMENCLATUREAND PACKAGINGTel 800-776-9888 Email 4 MELF Tantalum .12 Transistors and 14 Lead 27 (Ball Grid Array)..36 Flip Pitch booklet is a plain-English introduction to SURFACE MOUNT nomenclatureand PACKAGING . Soon you will be speaking the language of SURFACE Mountjust like a NomenclatureThere are many different types of SURFACE MOUNT packages . Each time anew SURFACE MOUNT package is developed a new name is created. Thesenames are usually abbreviated by their initials. As an example: The QuadFlat Pack is commonly known as the QFP. Unfortunately, some packageshave more than one name.
2. Package versus Packaging Let's start by clarifying the difference between the words "package(s)" and "packaging." The word "package" is used in this book to refer to the component's physical shape or outline. The word "packaging" is used in this book to describe how the component is stored. As an example: Tape and Reel is the packaging. QFP ...
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