Transcription of System in Package Solutions using Fan-Out Wafer …
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System in Package Solutions using Fan-Out Wafer …
System in Package Solutions using Fan-Out Wafer Level Packaging Technology J. Campos; S. Kroehnert; E. O Toole; V. Henriques; V. Chatinho; A. Martins; J. Teixeira; A. Cardoso; A. Janeiro; I. Barros; O. Tavares; R. Almeida June 27th, 2013 SEMI Networking Day: Packaging - Key for System Integration Nanium SiP Solutions using FO-WLP, June 27th, 2013; Internal Use Content Introduction to FO-WLP and WLSiP Enablers of WLSiP WLSiP developments based on FO-WLP Summary & Conclusions Acknowledgement 2 Nanium SiP Solutions using FO-WLP, June 27th, 2013; Internal Use Content Introduction to FO-WLP and WLSiP Enablers of WLSiP WLSiP developments based on FO-WLP Summary & Conclusions Acknowledgement 3 Nanium SiP Solutions using FO-WLP, June 27th, 2013; Internal Use Introduction to FO-WLP technology FO-WLP eWLB technology is based on: Wafer on a carrier with KGD s (reconstituted Wafer ) Level Compression Molding 4 eWLB = Embeded Wafer Level Ball grid array Nanium SiP Solutions using FO-WLP, June 27th, 2013.
Nanium · SiP Solutions using FO-WLP, June 27th, 2013; Internal Use Content Introduction to FO-WLP and WLSiP Enablers of WLSiP …
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