Transcription of Technical Data Sheet ABLEBOND 84-1LMI - …
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TechnicalDataSheet ABLEBOND 84-1 LMIM arch-2009 PRODUCTDESCRIPTIONABLEBOND 84-1 LMIprovides thefollowingproductcharacteristics:Techn ologyEpoxyAppearanceSilverCureHeatcurePr oduct Benefits Electricallyconductive Lowbleed 84-1 LMI dieattachadhesiveisdesignedfor microelectronicchipbonding. Thisadhesiveisidealforapplicationbyautom aticdispenser 84-1 LMImeetstherequirementsofMIL-STD-883, ( rpm) ,BrookfieldCP51, 25 C, mPa s(cP):Speed5 rpm30,000 WorkLife@25 C, weeks2 ShelfLife(fromdateof manufacture): @5 C, months3 @-10 C, months6 @-40 C, year1 TYPICALCURINGPERFORMANCECureSchedule1 hour@150 C AlternativeCureSchedule2 hours@125 C (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment,ov enloadingandactua
Technical Data Sheet ABLEBOND® 84-1LMI March-2009 PRODUCT DESCRIPTION ABLEBOND® 84-1LMI provides the following product characteristics: Technology Epoxy Appearance Silver Cure Heat cure
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