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technical datasheet - MicroChemicals

APPLICATIONG eneral purpose positive tone photoresists featuring a special PAC (Photo Active Compound) engineered to prevent poisoning of plating solutions and extend plating bath life. Excellent substrate adhesion for wet etch applications. Wide compatibility with electro-plating solutions Safe solvent Single coat thicknesses from to >20 m May be cured as a permanent dielectric insulatorTYPICAL PROCESSSoft Bake: 90-115C*Rehydrate: for films > m thickExpose: 350-450nm sensitiveDevelop: Spray or immersion Developer type: Inorganic (IN)* Use higher soft bake temp.

AZ P4000 Series photoresists may be thermally cured after develop to form stable dielectric isolators. The dielectric properties are cure temperature dependent as shown in the table below.

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