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The effects of particle size and content on the …

1. IntroductionPolymers with excellent electrical insulation havebeen extensively used as packing materials in elec-trical devices due to their good process ability, lightweight and low cost. Nevertheless, the thermal con-ductivity of polymers are generally very low ( 1 K 1), and it has been widely rec-ognized that the thermal conductivity of these poly-mers has to be enhanced to lower the energy lossand increase the stability of the devices. With theincreasing demand for high density power andenergy transmission of electronic devices, fabrica-tion of insulating polymer materials with high ther-mal conductivity has become crucial [1 4].

Filler size and shape are also important factors for the thermal conductivity and mechanical properties [14, 15]. Zhou et al.[16] used Al 2O 3 with different size to fill silicone rubber, and reported that nano-

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