Transcription of THE RIGHT SEAL - Greene Tweed
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THERIGHTSEALYOURGUIDE TOSEALING TOSEALING , Tweed & of ContentsiIntroduction .. iiiChapter 1: Sealing Requirements in the Semiconductor Industry .. 1 Semiconductor Sealing Basics .. 1 Finite Element Analysis (FEA) .. 2 Semiconductor Manufacturing Requirements .. 3 Ultrapure Deionized Water Systems (UPDI) .. 3 Photolithography (Aqueous/Solvents) .. 4 Acids .. 5 Plasma Systems - Etch and CVD .. 6 Diffusion Systems .. 8 Flat Panel Display Manufacturing .. 8 New Process Areas .. 9 More Demanding Line Geometries .. 9 Cost of Success .. 9 Future Process Technologies .. 9 Chapter 2: Physical Properties of Elastomers .. 11 Fluid Resistance .. 11 Hardness .. 11 Toughness .. 12 Tensile Strength .. 12 Elongation .. 12 Compressive Force .. 12 Modulus .. 13 Tear Resistance .. 13 Abrasion Resistance .. 13 Volume Change .. 13 Compression Set .. 14 Thermal Effects .. 14 High-Temperature .. 14 Low-Temperature .. 14 Resilience .. 15 Deterioration .. 15 Corrosion .. 15 Permeability.
the right seal your guide to sealing in semiconductor processing the right seal release 3.0
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