Transcription of TI OMAP4430 POP SMT Design Guideline (Rev. C)
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TI OMAP4430 POP SMT Design Guideline (Rev. C)
1TI OMAP4xxx POP SMT Design Guideline We SupportMichael Chen (TITL PKG)Kenji Masumoto (HIJI PKG)Shawn Wu (TITL PKG)Kurt Wachtler (WTBU PKG)2 Index:XPackage IntroductionXOMAP4 SMT Process sharingXAppendix9 Stencil/PCB Design guide9 Memory chip flux/solder dipping in 1-step mounting9 The example of Pick & Place machine condition setting9 Reflow profile recommendation9 SMT experiment examples9 Through molded via solder rework methods9X-ray examples9 Screen print material and tool examples9 Package warpage affect examples3 OMAP4 XXX POP PackagesMemoryOMAP 4 System Board4 OMAP4xxxMechanical Drawing of OMAP4xxx CBS (TMV)
24 Flux Dipping Paste Dipping OMAP4 Package OMAP4 CBS Daisy Chain OMAP4 CBS Daisy Chain Memory Package Mock Up Mock Up SMT Board NSMD Pads SMD Pads Bottom BGA Paste Shenmao PF-606-P (SAC305) Shenmao PF-606-P (SAC305) Top BGA …
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