Transcription of Understanding Functional Safety FIT Base Failure Rate ...
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Understanding Functional Safety FIT Base Failure Rate ...
Technical White PaperUnderstanding Functional Safety FIT base FailureRate Estimates per IEC 62380 and SN 29500 Bharat Rajaram, Senior Member, Technical Staff, and Director, Functional Safety , C2000 Microcontrollers,Texas InstrumentsABSTRACTF unctional Safety standards like International Electrotechnical Commission (IEC) 615081 and InternationalOrganization for Standardization (ISO) 262622 require that semiconductor device manufacturers address bothsystematic and random hardware failures. Systematic failures are managed and mitigated by following rigorousdevelopment processes. Random hardware failures must adhere to specified quantitative metrics to meethardware Safety integrity levels (SILs) or automotive SILs (ASILs). Consequently, systematic failures areexcluded from the calculation of random hardware Failure of Contents1 Types of Faults and Quantitative Random Hardware Failure Metrics.
In the excerpt shown in Figure 5-1, which is from a TI functional safety FIT document for a bipolar operational amplifier, the λ ref FIT rate is 12 FIT and the reference die temperature is 55°C. This information is sourced from the SN 29500 standard. Figure 5-1. TI Standard Functional Safety FIT Documentation for the SN 29500 Standard
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