Transcription of Understanding Functional Safety FIT Base Failure Rate ...
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Understanding Functional Safety FIT Base Failure Rate ...
Technical White PaperUnderstanding Functional Safety FIT base FailureRate Estimates per IEC 62380 and SN 29500 Bharat Rajaram, Senior Member, Technical Staff, and Director, Functional Safety , C2000 Microcontrollers,Texas InstrumentsABSTRACTF unctional Safety standards like International Electrotechnical Commission (IEC) 615081 and InternationalOrganization for Standardization (ISO) 262622 require that semiconductor device manufacturers address bothsystematic and random hardware failures. Systematic failures are managed and mitigated by following rigorousdevelopment processes. Random hardware failures must adhere to specified quantitative metrics to meethardware Safety integrity levels (SILs) or automotive SILs (ASILs). Consequently, systematic failures areexcluded from the calculation of random hardware Failure of Contents1 Types of Faults and Quantitative Random Hardware Failure Metrics.
The IEC TR 62380 IC failure rate can be modeled as sum of the die, package and electrical overstress (EOS) related failure rates, where: • The die-related failure rate formula includes terms for IC type and IC technology, transistor count, thermal mission profile, junction temperature, and operating and non-operating lifetime.
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