WLCSP (FI - STATS ChipPAC Ltd

LEVEL chip scale PACKAGINGW afer Level chip scale Package ( WLCSP ) offers one of the most compact package footprints, providing increased functionality, improved thermal performance and finer pitch interconnection to the printed circuit board. With WLCSP , all of the manufacturing process steps are performed in parallel at the silicon wafer level rather than sequentially on individual chips to achieve a package that is essentially the same size as the die. The resultant package has dielectrics, thin film metals, and solder bumps directly on the surface of the die with no additional packaging . The basic structure of the WLCSP has an active surface with polymer coatings and bumps with bare silicon exposed on the remaining sides and back of the die. Breakthrough FlexLine wafer Level ManufacturingSTATS ChipPAC s innovative approach to WLCSP manufacturing, known as the FlexLine method, provides customers freedom from wafer diameter constraints, while enabling supply chain simplification and significant cost reductions that are not possible with a conventional manufacturing flow.

wwwstatschippacco WAFER LEVEL CHIP SCALE PACKAGING Wafer Level Chip Scale Package (WLCSP) offers one of the most compact package …

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  Scale, Packaging, Levels, Chip, Wafer, Wlcsp, Wafer level chip scale packaging wafer

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