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Key Capability Overview . Smallest Package • Low-cost, wire-bond, chip-scale BGA packaging • Available in a 10x10mm package for maximum system integration

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Introduction XAPP1113 (v1.0) November 21, 2008 www.xilinx.com 2 R • DDC design files for multi-channel MRI, targeting both Virtex-5 and Spartan®-DSP

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PROFESSIONAL PO WER AMPLIFIERSPROFESSIONAL PO WER …

PLX Series Features • Exclusive PowerWave™ power supply for superior bass and lighter weight • Ultra-low distortion (0.03% THD at 8 ohms) & studio-quality noise floor (-107 dB) • LED indicators include bridge mono and parallel input modes • Compact 2 RU, 21 lbs. and 13" deep chassis fits into any rack • Class H output reduces AC power draw and heat by 40%

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