Advanced IC Packaging as New Semiconductor …
Advanced IC Packaging as New Semiconductor Industry Collaboration Platform CP Hung, Ph.D. VP of Corporate R&D ASE Inc. 25 Jun 2013
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www.yole.fr2 Biography & contact ABOUT THE AUTHORS Amandine PIZZAGALLI, Market & Technology Analyst, Equipment and Materials for Advanced Packaging • Santosh Kumar is currently working as Senior Technology & Market Research Analyst at …