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Surface Mount Placement Equipment Characterization 1 INTRODUCTION 1.1 Scope This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in docu-
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www.ipc.orgSurface Mount Placement Equipment Characterization 1 INTRODUCTION 1.1 Scope This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine’s placement capability and confor-
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www.ti.comConclusion www.ti.com Plots in Figure 3 show the relationship of RθJA versus the copper mounting pad area and its surface placement on the board. It is apparent that increasing copper mounting pad area considerably lowers RθJA from approximately 110°C/W to 40°C/W in the range from 0.0123 to 1 square inches.
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