ASSOCIATION CONNECTING ELECTRONICS …
IPC-9850Surface MountPlacement EquipmentCharacterizationDeveloped by the SMT Component placement equipment Subcommittee(5-41) of the Assembly equipment Committee (5-40) of IPCUsers of this standard are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135Tel 847 847 CONNECTINGELECTRONICS INDUSTRIES September 16, 2002Table of ........................................ ............................ ........................................ ......................... ........................................ .................. Considerations.
Surface Mount Placement Equipment Characterization 1 INTRODUCTION 1.1 Scope This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in docu-
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