BEOL Interconnect Innovations for Improving Performance
Feb 23, 2017 · Innovations in Silicon Manufacturing February 23, 2017 Paul Besser, NCCAVS Symposium in San Jose, CA 4 11 Elements ... (reduction) •RC Delay ... •Process-induced damage to trench sidewall and top interface is a major integration challenge**
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ADVANCED PACKAGING TECHNOLOGY - nccavs …
nccavs-usergroups.avs.orgcomponents packaging and assembly at Philips Semiconductor, Linear Technology and Corwil Technology. Prior to joining Promex, she was Package Assembly Manager at Silanna in Australia.
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