DRAM Technology - Smithsonian Institution
DRAM Technology 7-6 INTEGRATED CIRCUIT ENGINEERING CORPORATION POLY 5 CAPACITOR SHEET POLY 4 CAPACITOR PLATE NITRIDE ETCH-STOP LAYER “STEM” POLY 2 BIT CONTACT PAD POLY 2 BIT LINE CONTACT REFLOW GLASS N+ S/D POLYCIDE 1 SELECT GATE Photo by ICE, “Memory 1997” 20844 Figure 7-8. Samsung 64Mbit DRAM …
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Profitability in the Semiconductor Industry
smithsonianchips.si.eduProfitability in the Semiconductor Industry 1-2 INTEGRATED CIRCUITENGINEERING CORPORATION From year to year, the health of the semicon-ductor industry as a whole is indicated by its
Section 4 Worldwide ASIC Market - Smithsonian …
smithsonianchips.si.eduthe total logic market mirrored the MOS logic segment. PROS AND CONS OF ASICs ... Worldwide ASIC Market 4-4 INTEGRATED CIRCUIT ENGINEERING CORPORATION
Yield and Yield Management - Smithsonian Institution
smithsonianchips.si.edusemiconductor industry. Line yield refers to the number of good wafers produced with-out being scrapped, and in general, measures the effectiveness of material handling, process control, and labor. Die yield refers to the number of good dice that pass wafer probe testing from wafers that reach that part of the process. It is intended to prevent
Changing Wafer Size and the Move to 300mm
smithsonianchips.si.eduwafer. Unfortunately, due to equipment pro-ductivity and price increases for larger wafer processing tools, the cost savings resulting from wafer size transitions may not scale with these die per wafer calculations. For instance, 200mm wafers offer nearly twice the area of 150mm wafers (1.78X), but many early adopters of 200mm technology argue
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