Flux/underfill Compatibility Study for Flip-chip …
Flux/underfill Compatibility Study for Flip-chip Assembly Process Phuthanate Phoosekieaw1+and Sanya Khunkhao1 1Faculty of Engineering, Department of Electrical Engineering Sripatum University, 61 Phaholyothin Rd, Jatujak, Bangkok 10900, Tel (662) 579-1111 Ext: 2272
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