INTERNATIONAL
A major portion of semiconductor device product ion is devoted to digital logic that needs to support a technology platform for two device types: 1) -performance logic,high and 2) low-power/high-density logic. Key considerations for this technology platform are speed, power, density, and cost.
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2021 IRDS More than Moore
irds.ieee.orgYoshiyuki Nonogushi, Kyoto Institute of Technology Kafil M Razeeb, Tyndall James Rohan, Tyndall Luca Roselli, IUNET Stefano Saggini, IUNET Hiroshi Toshiyoshi, University of Tokyo Eric Yeatman, Imperial College London Flexible/Wearable Electronics Benjamin Iñiguez, URV (team leader) Alessandra Costanzo, IUNET Danilo DeMarchi, IUNET
2020 EDITION - irds.ieee.org
irds.ieee.orgP1770™, IEEE P149™, IEEE 1720™, etc.) are registered trademarks or service marks of The Institute of Electrical and Electronics Engineers, Incorporated. All other products, company names or other marks appearing on these sites are the
IRDS 2021 More Moore
irds.ieee.org• Memory technologies • DRAM technologies • Flash technologies • Emerging non-volatile-memory (NVM) technologies More Moore targets bringing PPAC value for node scaling every 2−3 years [2]: • (P)erformance: >15% more operating frequency at scaled supply voltage • (P)ower: >30% less energy per switching at a given performance
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