LDMOS Technology for RF Power Amplifiers

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Figure 1: Schematic image of an LDMOS device. Modern LDMOS technology is processed in a CMOS-fab, exploiting 8-in wafer manufacturing and lithography tools with capabilities down to 0.14 μm. Additions to the CMOS process are a source sinker to the substrate, backside metallization, and tungsten shields between the drain and gate. The back-

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