MEMS: Microelectromechanical Systems
MEMS Packaging ! Purposes " Reduce EMI " Dissipate Heat " Minimize CTE " Deliver Required Power " Survive Environment Types of MEMS Packages ! Ceramic Packaging " Hermetic when sealed " High Young’s Modulus " Flip Chip or Wirebonding ! Plastic Packaging " Not Hermetic " Postmolding " Premolding !
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