Moisture/Reflow Sensitivity Classification for Nonhermetic ...

Exigences et critères d’acceptabilité pour l ...

B.J. Franco, Honeywell Aerospace Richard Rumas, Honeywell Canada John Mastorides, Honeywell International William Novak, Honeywell International

A standard developed by IPC

IPC/WHMA-A-620B-S 2013 - June Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B Supersedes IPC/WHMA-A-620AS with Amendment 1 June 2012

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Appendix B RoHS Substances and Exemptions List …

March 2011 IPC-1752A Appendix B RoHS Substances and Exemptions List The EU RoHS Directive continues to be updated over time. As these changes are made, the most current exemption list will

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JOINT INDUSTRY GUIDE (JIG) - IPC

JOINT INDUSTRY GUIDE (JIG) Material Composition Declaration for Electrotechnical Products JIG-101 Ed 4.0 (Revision of JIG-101 Ed. 3.1, September 2010)

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(Mechanical, Electrical, Environmental and Quality ...

IPC-9591 Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices Developed by the Air Moving Devices Standard Subcommitte (9-81) of

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Certification Quality Initiative User’s Guide v

Certification Quality Initiative User’s Guide v.2 IPC , i n c . 3000 L a k e s i d e D r i v e , S u i t e 309S B a n n o c k b u r n , I L 6 0 015

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IPC Polcies and Procedure Manual (April 2017 …

Page | 2 IPC Professional Training and Certification Policies and Procedures v6 1 BACKGROUND. This Policy and Procedures (P&P ) document is applicable to IPC’s Professional Training and Certification Programs (hereinafter “Programs”), including lecture-based discrimination -skills

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IPC-TM-650 TEST METHODS MANUAL

1 Scope Moisture absorption can cause delamination or other damage in printed boards subjected to soldering heat. This test is a process control tool to determine both the bulk

Design and Assembly Process Implementation for …

IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components Developed by the IPC Bottom Termination Components (BTC) Task

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ELECTRONICS INDUSTRIES Design and Assembly …

IPC-7095A Design and Assembly Process Implementation for BGAs Developed by the Device Manufacturers Interface Committee of IPC Users of this publication are encouraged to participate in the

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JEDEC STANDARD - Computer Action Team

JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113D (Revision of JESD22-A113C) AUGUST 2003

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JEDEC STANDARDS - antistatic bags

aging and soldering for the purpose of allowing simulation of the soldering process to be used in the device applications. It provides procedures for dip and look solderability testing of through hole, axial and surface …

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JEDEC STANDARD - INSIDIX

JEDEC Standard No. 22-B112A Page 2 Test Method B112A (Revision of Test Method B112 3 Terms and definitions (cont’d) deviation from planarity: The difference in height between the highest point and the lowest point on the package substrate bottom surface measured with respect to the reference plane.

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ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES …

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 1 PURPOSE The purpose of this standard is to identify the classification level of nonhermetic solid state surface mount devices (SMDs)

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SM-4030F Baseline Requirements for Hot Solder Dip

SIX SIGMA WINSLOW AUTOMATION, INC. Title Baseline Requirements for Hot Solder Dip Number SM-4030 Rev. F Page 4 of 15 Copyright© 2007 Six Sigma.

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MSL Ratings and Reflow Profiles - Texas Instruments

www.ti.com Peak Reflow Temperature Similarly, exposing it to higher humidity conditions or higher temperatures potentially shortens the floor life. The Recommended Equivalent Total Floor Life table in IPC/JEDEC J-STD-033C provides guidance on floor life for differing temperatures (20°C to 35°C) and a range of relative humidity (5% to 95%) for

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