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Xilinx UG112 Device Package User Guide

Xilinx UG112 Device Package User Guide

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Acquisition and Package Thermal Database”, added Figure 3-11, page 53, “Package Thermal Data Query for Device-Specific Data” (query tool replaces Table 3-1: “Summary of Thermal Resistance for Packages”, which was removed). Updated “Recommended PCB Design Rules for BGA, CSP, and CCGA Packages,”

  Thermal, Xilinx

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