Example: marketing
Xilinx UG112 Device Package User Guide
Acquisition and Package Thermal Database”, added Figure 3-11, page 53, “Package Thermal Data Query for Device-Specific Data” (query tool replaces Table 3-1: “Summary of Thermal Resistance for Packages”, which was removed). Updated “Recommended PCB Design Rules for BGA, CSP, and CCGA Packages,”
Download Xilinx UG112 Device Package User Guide
Information
Domain:
Source:
Link to this page: