SMTA International Conference 2007 - …

1 Surface Mount Technology Association SSMMTTAA IInntteerrnnaattiioonnaall CCoonnffeerreennccee 22000077 October 7-11, 2007 Orlando, Florida, USA Volume 1 of 2 Printed from e-media with permission by: Curran Associates, Inc. 57 Morehouse Lane Red Hook, NY 12571 ISBN: 978-1-60423-880-8 Some format issues inherent in the e-media version may also appear in this print version. Copyright 1999-2007 SMTA, All rights reserved. Reproduction in whole or in part without permission is prohibited. SMTA Headquarters 5200 Willson Road Suite 215 Edina MN 55424 Fax Surface Mount Technology Association SMTA International Conference 2007 TABLE OF CONTENTS Volume 1 PEEK for Lead-Free soldering Processes and Electronics 1 Jeff Chen, Michael Gross, Craig Meakin Elimination of Flip Chip Electromigration Failures using Embedded Chip Build-Up Fillion, Tan Zhang, Charles Woychik Through Silicon Via Interconnection Enabling 3D Wafer-Level 15 Lars Boettcher, Andreas Ostmann, Dionysios Manessis, Herbert Reichl Electrical Characterizations of TSOP II and FBGA Packages for High-Speed 23Yi-Chang Lee, An-Hong Liu, Emerson Chiu, Vincent Tu, Hsiang-Ming Huang, Shu-Ching Ho, Hao-Yin Tsai, Chih-Ming Lin, Yeong-Her Wang Reliability Assessment of Embedded Chip Build-Up BGA Packages - Part 28 Charles G.

2 Woychik, Raymond A. Fillion, Tan Zhang, Paul McConnelee, Shane M. Lewis Copper as a Viable Solution for IC 35 Sheila Rima C. Magno, Jean Ramos, Eduardo Pecolera, Chris Stai Metallization Options for Optimum Chip-on-Board 42 Mukul Luthra Mitigating High Stress Failure in a High-Performance RF/Microwave Module 52 Quan Qi, Curt Miller, Daryl Hollis, Kathleen Ullom, Jeff McDonald, Ken Vielmette, Heidi Davis A Product Environmental Compliance Case Study Establishing a ROHS Disclosure Audit Trail for an Electronics Manufacturing Services 59 Jim Dills, Rebecca Harris EU ROHS and Upcoming 68 Nikki Johnson ROHS - A Business Process 74 Mahesh Patil Proposed Curriculum for Environmental Engineers in 81 John Hawley, Manthos Economou Reflow Process Enhancement and Wetting Analysis in 63Sn/37Pb and Sn-Ag-Cu Lead-Free 90 Scott J. Anson, Jacob G. Slezak, Krishnaswami Srihari Air Reflow of Lead-Free soldering for Fine Pitch 100 Wei Wei Chin, Ching Ching Chong, Lian Huat Ng, Cheng Siew Tay Void Free soldering Technology for Power 107 Mathias Nowottnick, Uwe Pape, Rolf Diehm Investigation into the Mass Imaging Aspects of Wafer Level Chip Scale Package Solder Paste 113 Clive Ashmore Correlating Printing Process Defects to End of Line 120 Vatsal Shah, Rita Mohanty, Arun Ramasubramanian, Joseph Belmonte Reservoir Solder Paste 129 Michael R.

3 Burgess, James A. Robbins Process and Reliability Study of Lead-Free Wave soldering for Large Thick 135 Jennifer Nguyen, Robert Thalhamer, David Geiger, Dan Rooney, Dongkai Shangguan The Influence of the PWB Fabrication Electrodesposition Process on Copper Erosion During Wave 146 Chrys Shea, Jim Kenny, Jean Rasmussen, Girish Wable, Quyen Chu, Shiang Teng, Keith Sweatman, Kazuhiro Nogita Flux Selection for Lead-Free Wave 167 Douglas Watson, Jasbir Bath, Pan Wei Chi Vapor Phase Technology, and its 176 Allen W. Duck, Claus Zabel Lead Free Product Quality in Vapor Phase 181 Pravin Sequeira Vapor Phase A Current Overview and its Application for Lead Free 188 David Suihkonen, Atul Mehta Methodology for Evaluating Data for "Reverse Compatibility" of Solder 199 Bill Russell, Dennis Fritz, Gary S. Latta The Influence of Process Parameters to Double-sided Assembly BGA Reliability in Backward Compatible 218 Limin Chen, Yuming Ye, Sang Liu, Syber Chen, Yunhua Tu, Zhiwei Song, Zhao Xiang Development and Validation of a New Test Platform for Cleaning Process Development Phase 223 Mike Bixenman, Steve Stach A New Definition of Low Stand Off 231 Harold Wack, Umut Tosun, Naveen Ravindran, Joachim Becht, Helmut Schweigart, Dirk Ellis A Comparative Analysis of Aqueous based Cleaning Chemistries on High Reliability Electronic 247 Dale Lee Liquid soldering Techniques and Process Optimization A Case Study for Low Defect Wave and Selective soldering 254 Denis Barbini, Ursula Marquez de Tino, Kaustubh Kalkundri, Gerjan Diepstraten Pb-Free Selective soldering Process 263 Elavarasan T.

4 Pannerselvam, S. Manian Ramkumar Lead-Free Selective soldering Applications, Advantages, and Case 271 Alan Cable Assembly Process Technology Research of 0201 Components on Large Size 277 Lei Feng, Dongqing Ding, Shoukai Zhang, Fujiang Sun Stencil Printing Evaluation of a 01005 Component based on a Statistical 282 Sung Chul Joo, Daniel F. Baldwin, Weon Woo Nam A Study of 0201 s and Tombstoning in Lead-Free 292 Paul Neathway, Andrew Butterfield, Quyen Chu, Nick Tokotch, Robert Haddick, Jean-Marc Peallat, Chrys Shea, Prashant Chouta Area Array Connector Reliability: Impact of Conversion to Lead Free and of Test Vehicle Design 301 Heather McCormick, Alex Chan, Richard Coyle, Donald Harper, Steve Minich, Damir Jelkovic, Brent Peterman, Mark Gray Reliability of SMT Connectors due to Thermal and Mechanical 307 Arv Sinha, Joe Kuczynski, Amanda Mikhail, Theron Lewis Solder Joint and Solder Fillet Optimization for Surface Mounted Terminal 313 Michel Hodak, Dubravka Kusmic The Effect of Critical to Function Parameters of the Lead-Free Mini-pot Through-hole Connector Rework Process on the Final Barrel Copper 319 Alan Donaldson Solder Reliability Model for BGA and LCC Joints Given Lead-Free Rework 332 Frank Liotine, Jr.

5 Low Melting Alloys: A New Solution to Lead Free Rework Process 340S. Bagheri, P. Snugovsky, Z. Bagheri, C. Hamilton, H. McCormick, M. Romansky Process Development and Reliability Evaluation for Inline Package on Package (PoP) Sjoberg, Todd Castello, David A. Geiger, Dongkai Shangguan Low Profile NAND Flash Stacked 355 Vern Solberg Reworking Package on Package 362 Paul Wood The Effect of Process Voiding on BGA Solder Joint Fatigue Life Measured in Accelerated Temperature 367 Sundar Sethuraman, Richard Coyle, Richard Popowich, Peter Read BGA Component Thermal Warpage and Implication for Board-Level Interconnects 373 Ming Zhou, Hua Lu Board Level Reliability of Lead-Free Soldered Interconnects - Test Albrecht, M. Heimann, Ch. G tze, M. L ffler Alternate Solder Balls for Improving Drop/Shock 389 Ahmer Syed, TaeSeong Kim, SeWoong Cha Investigation of Impact Reliability of Pb-Free Solder Interconnects in Ball Grid Array 396 Fahad Mirza, Saurabh Athavale, Krishnan Vishwanathan, Amol Kane, Mike DiPietro, Eric Cotts, James Pitarresi, Daryl Santos Experiences with Monotonic Bend Test of Electronic 404 Thomas Koschmieder Second Level Solder Joint Reliability of Quad Flat No-Lead (QFN)

6 Packages for use in IPC Class-2 411 Alex Chan, Aman Khan, Robert Kinyanjui Mechanical Reliability and Thermal Design Studies of QFN 419 Dongji Xie, Younes Shabany, Jonathan Wang, Sammy Yi Common Process Defect Identification of QFN Packages using Optical and X-Ray 424 David Bernard, Bob Willis Solder Joint Shape Optimization for Ceramic Leadless Chip 432 Olli Salmela Volume 2 Comparison of the Level 2 Characteristics of HITCETM Substrate Assembled with SAC and High Lead 441 Nicole Butel Unified Finite Element Model for Prediction of Solder Joint Fatigue Under Thermal, Power, and Vibration Environments for Ceramic Area Array Electronic 459 Andrew Perkins, Suresh K. Sitaraman The Development of a Single Chamber, Multi-Metal, Bump Plating 478 Steven Cho, Lee Levine, Solomon Basame Wetting and Spreading Studies for Lead Free Solder and Flux Materials in Flip Chip 483 Jinlin Wang The Study of Laser Repair Through BCB Passivation in Flip Chip 489 Shu-Ching Ho, Hsiang-Ming Huang, Yi-Chang Lee, Yeong-Jyh Lin, An-Hong Liu Reliability and Failure Mode Analysis of a Void Free Hybrid No-Flow Underfill 495 Daniel F.

7 Baldwin, Michael Colella Frame Level Packaging: Flip Chip 503 Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, Jerry Tan Reliability Impact of Copper-Doped Eutectic Tin-Lead Bump and its Voiding upon Flip Chip 509 David Ihms, Shing Yeh Lead Free Application of Flip Chip 518 Renzhe Zhao, Qing Ji, Qiaohong Huang, George Carson, Michael Todd Void Formation Study of High I/O Density and Fine Pitch Flip Chip in Package using No-Flow 524 Sangil Lee, Daniel F. Baldwin, Raj Master, Srinivasan Parthasarathy New Development in Flip Chip Underfills for Lead-Free 530 Larry Wang, Violet Evans, George Sears, Guoyun Tian Testing Passive Components for Flexure Crack 537 Daniel Skamser, Cory Riedl, Bill Sloka, John Evans, Zhaozhi Li High Temperature Reliability Limits of 544 Kent Larson Process Development and Optimization using a Newly Designed Conformal Coating Test 552 Jason Keeping Effect of Temperature Cycling Parameters on the Solder Joint Reliability of a Pb-Free PBGA 563 John Manock, Richard Coyle, Richard Popowich, Debra Fleming, Peter Read, Brian Vaccaro, John Osenbach, Dan Gerlach, Heather McCormick Immersion Tin as a Cost-Effective and Reliable Surface Finish for Pb-Free Automotive Electronics Applications - Phase II 573 Hugh Roberts, Sven Lamprecht, Elaine Bevan, John Coates.

8 Steve Prosser Thermo-Mechanical Reliability Management Models for Area-Array Packages on Cu-Core and No-Core 581 Pradeep Lall, Luke Drake, Timothy Moore, Jeff Suhling, Milan Shah Solder Joint Integrity Impact of 98%Tin/2%Bismuth Component Surface 596 Dave Hillman, Jon Soole, Iver Anderson, Mark Bancroft, Chris Hess, Dave Lopez Organic Solderability Preservative Lead Free Reflow 606 Scott J. Anson, Jacob G. Slezak Impact of Aging and Storage Conditions of OSP PCBs on BGA Solder Joint 612 Bala Nandagopal, Sue Teng, Mason Hu Silver and Sulfur: Case Studies, Physics, and Possible 620 Craig Hillman, Joelle Arnold, Seth Binfield, Jeremy Seppi Creep Corrosion on PCB Surfaces: Improvements of Predictive Test Methods and Developments Regarding Prevention 633 Lenora Toscano, Ernest Long, John Swanson Creep Corrosion on Lead-Free Printed Circuit Boards in High Sulfur 642 Randy Schueller soldering and Solder Joint Reliability for Selected Surface Finishes with Lead Free SAC305 654 George Milad, Don Gudeczauskas The Case for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a Surface 660 Jack D.

9 Fellman ClearVue - Tomosynthetic Reconstruction Techniques for X-Ray Inspection of Circuit 666 Rohit Patnaik, Dale Thayer, Peter Edelstein Process Control with Automated X-Ray Inspection of Solder 672 Thomas Mayer Real Time X-Ray Inspection System: An Alternative Inspection Scheme for Fine-Pitch 679 Rodolfo del Mundo Using Six Sigma Techniques to Optimize Cleaning in Class III 682 Mike Bixenman, Tom Gervascio, Ronald Lasky Driving Manufacturing and Test Strategy Via Data 691 Alek Jaworski, Dan Frame, Mark Dickson You Don't Have to be a Blackbelt to Achieve 700 Michael R. Weekes Eight Actions to Strengthen the EMS/OEM Procurement 709 Bryan Gillespie Bridging the Gap Independent Distributors Add Flexibility to the Supply 715 Tony Musto Supporting a Full Product Life Cycle in the Medical Instrumentation 718 Kevin Stokes, Paul Plante China RoHS 723 Abby Tsoi A Compliant and Creep Resistant SAC-Al(Ni) 729 Benlih Huang, Hong-Sik Hwang, Ning-Cheng Lee Cumulative and Synergistic Effects of Combined Mechanical Loading of Lead-Free 739 Brian Roggeman, Peter Borgesen Nanotechnology Advances in Printable Systems for Conductors and 745 Alan Rae Lead Free Wave soldering : Influence of Alloys, Board Design, and Process Parameters on Defect 750 Denis Barbini, Quyen Chu, Denis Jean, Stuart Longgood, Paul Lotosky, Chrys Shea The Pb-Free SnAgCu Ball Grid Array (BGA) Components in SnPb Assembly Process.

10 Process Characterization and Solder Joint 759 Robert Kinyanjui, Quyen Chu A Transition Strategy for High-Reliability Applications to Pb-Free 769 Mike Davisson Fatigue Damage Prediction during Thermo-Mechanical Cycling for Lead-Free 776 Milos Dusek, Chris Hunt The SnAgCu Solder Joint Failure of BGA Type Package in 2nd Level 780 Jeffrey C. B. Lee Lead-Free (PbFree) Feasibility Program: Assembly and Testing of a Functional IPC Class 3 Avionics Data 786 Dave Hillman, Matt Hamand The Economical Development of a Lead-Free Assembly Process: A Practical Case Study that Minimized Conversion and Operational 797 Tom Borkes, Pat McDonough Qualification of a Lead-Free Card Assembly and Test Process for a Server Complexity 805 Matthew Kelly, Marie Cole, Jim Wilcox, Jim Bielick, Timothy Younger, David Braun Studies on the Removal of Copper during Minipot Rework with Different Lead-Free 815 Kantesh Doss, Alan Donaldson, Andrew Tong, Raiyo Aspandiar Lead-Free Rework Experiences using SAC and Sn-Cu Based 824 Peter Biocca Twisted Wire Interconnects.