Requirements for Power Conversion Devices for the …

1 IPC-9592 ARequirements for PowerConversion Devicesfor the computer andTelecommunicationsIndustriesDeveloped by the Power Conversion Devices Standard Subcommittee(9-82) of the OEM Management Council Steering Committee (9-80)of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-9592 - September 2008 Table of Contents1 Statement of Scope .. Description .. Purpose .. Order of Precedence When Purchasing.

2 12 APPLICABLE DOCUMENTS AND TERMS IPC .. International .. Standards Association (Canada) .. Organization for Standardization .. China .. Electrotechnical Commission .. Oficial Mexicana .. Norm .. United States .. Terms, Definitions and Acronyms .. 43 PRODUCT SPECIFICATION ANDDOCUMENTATION Product Classification System .. I General or Standard PCDs .. II Enhanced or Dedicated Service PCDs .. to dc and dc to dc PCDs .. Categories of Product .. Requirements .. Sheet Information - Form, Fit and Function.

3 Power Specifications .. to dc PCD Data Sheet .. to dc PCD Data Sheet .. , Indicator, and Control Specifications .. Specifications .. to dc PCD Data Sheet .. to dc PCD Data Sheet .. to dc and dc to dc PCD Data Sheet .. to dc and dc to dc PCD Data Sheet .. and Regulatory .. to dc and dc to dc PCD Data Sheet .. Dimensions and ElectricalConnections .. to dc and dc to dc PCD Data Sheet .. Material Control and Labeling .. Revision Control .. 134 DESIGN FOR Reliability Prediction (FIT).

4 Component Selection .. Metal Corrosion with PCD Electronic Assembly . Testing .. Printed Circuit Board SurfaceFinishes .. Finishes for the computer Industry .. Finishes for TelecommunicationIndustry .. Finishes for Assembly Parts, ECMas a Failure Mechanism and ConformalCoatings .. (Thick Film) .. Migration Failures .. Coatings .. Derating Guidelines .. Documentation Requirements .. Design Failure Modes and Effects Analysis(DFMEA) .. Voltage Spacing Design Requirements .. Moisture Sensitivity Level (MSL) Ratingof Surface Mount Power Conversion Devices (PCDs).

5 Of MSL Guidelines DuringAssembly of PCDs .. of MSL Requirements .. of MSL Rating .. Requirements .. Requirements for BMP Users .. Testing for MSL .. 215 DESIGN AND QUALIFICATION Design Verification Testing (DVT) .. of Testing .. Size .. Methods .. Conditions and Limits .. Report .. Verification Testing - ac InputParameters .. Conditions .. to Be Measured .. 22 May Verification Testing - dc InputParameters .. Conditions .. to Be Measured .. Verification Testing - Overall Input toOutput Parameters.

6 Conditions .. to Be Measured .. Verification Testing - dc OutputParameters .. Conditions .. to Be Measured .. Design Verification Testing - ProtectionFeatures .. Test Conditions .. Parameters to Be Measured .. Design Verification Testing - Input andOutput Signals and Indicators .. Test Conditions .. Parameters to Be Measured .. Design Verification Testing - Other ElectricalParameters, Features and Functions .. Current Sharing .. Conditions .. Procedure .. Verification Testing - Hot Swap.

7 Conditions .. Procedure .. Design Verification Testing - MechanicalCompliance .. Stress Testing (EST) .. Purpose .. Sequence for EST .. Preconditioning .. Accelerated Life Test (HALT) .. and Purpose .. Chamber Equipment Requirements .. Thermal and VibrationCapability .. Minimum ReportingRequirements .. and Thermal MonitoringCapability .. Requirements forAccelerometers .. Requirements forThermocouples .. Reporting Requirements forVibration and Thermal Monitoring .. Test Equipment .. and Loading.

8 Capability .. Hardware .. Reporting Requirements forLaboratory Equipment .. Size .. Test Requirements .. Verification .. Step Stress/CombinedEnvironment/Rapid Thermal Cycle .. Step Stress .. Reporting and DocumentationRequirements .. Cause Analysis and CorrectiveActions .. , Humidity and Bias (THB) .. Size .. Procedure .. Criteria .. Temperature Operating Bias (HTOB) .. Size .. Criteria .. Cycling (TC) Test .. Size .. Criteria .. and Temperature Cycling (PTC) Test .. Size.

9 Criteria .. and Vibration .. Overview .. Sequence .. Criteria .. Equipment .. 32 IPC-9592 AMay Mounting .. Vibration - Operating .. Size .. Method .. Criteria .. Random Vibration - Nonoperating .. Size .. Method .. Criteria .. Shock - Operating .. Purpose .. Applicability .. Sample Size .. Test Method .. Pass Criteria .. Free Fall .. Purpose .. Applicability .. Sample Size .. Test Method .. Pass Criteria .. Drop Test .. Purpose.

10 Applicability .. Sample Size .. Test Method .. Pass Criteria .. Other Environmental Stress Testing .. Corrosion Resistance .. Dust Resistance .. SMT Attachment Reliability .. Purpose .. Applicability .. Sample Size .. Test Method .. Pass Criteria .. Hole Pin Solderability .. Size .. Method .. Criteria .. Electromagnetic Susceptability (EMS) andOther Tests .. Continuous Wave .. Devices .. Size .. Method .. Criteria .. Immunity .. Devices .