Advanced Organic Technology For 2 5d Interposer

Advanced Packaging Current Trends & Challenges

FIWLP FOWLP 3D/2.5D FOPLP Silicon/ glass bridge Bump/ pillar TSV/ TGV Ceramic/ leadframe and others Advanced organic substrate Mold embedding Organic interposer FC WB CSP BGA Standard BGA Advanced LGA BGA LGA CSP Organic substrate Ceramic/ leadframe and others ... TECHNOLOGY ROADMAP: FROM NANO-SCALE TO MICRO-SCALE.. 2015 2017 2019 …

  Technology, Advanced, Organic, Interposer, Advanced organic, Organic interposer