Lead Standard Small Outline Package Soic
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AT28C16 16K (2K x 8) Parallel EEPROMs - Stanford University
cva.stanford.eduPackage Type 32J 32 Lead, Plastic J-Leaded Chip Carrier (PLCC) 24P6 24 Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 24S 24 Lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) W Die Options Blank Standard Device: Endurance = 10K Write Cycles; Write Time = 1 ms E High Endurance Option: Endurance = 100K Write Cycles; Write Time ...
AN2409, Small Outline Integrated Circuit (SOIC) Package ...
www.nxp.comSmall Outline Integrated Circuit AN2409 Application Note Rev. 3.0 Freescale Semiconductor, Inc. 3 3.2 Package Dimensions SOICs are offered in industry standard sizes and thicknesses with various options of lead quantity and pitch.
LT1028/LT1128 - Ultralow Noise Precision High Speed Op Amps
www.analog.comachieve a new standard of excellence in noise performance with 0.85nV/√Hz 1kHz noise, 1.0nV/√Hz 10Hz noise. ... S8 PACKAGE 8-LEAD PLASTIC SOIC V+ ... LT1128CS8#PBF LT1128CS8#TRPBF 1128 8-Lead Plastic Small Outline 0°C to 70°C LT1028CSW#PBF LT1028CSW#TRPBF LT1028CSW 16-Lead Plastic SOIC (Wide) 0°C to 70°C ...
Low Cost, General-Purpose High Speed JFET Amplifier Data ...
www.analog.comLead Temperature Range (Soldering 10 sec) 300°C 4 1 Specification is for device in free air: 8-lead SOIC package: θ JA = 155°C/W 16-lead SOIC package: θ JA = 85°C/W Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these ...
LF411 JFET-INPUT OPERATIONAL AMPLIFIER - TI.com
www.ti.comPackage Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LF411CD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C LF411CDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C
SURFACE MOUNT NOMENCLATURE AND PACKAGING
www.topline.tv2. Package versus Packaging Let's start by clarifying the difference between the words "package(s)" and "packaging." The word "package" is used in this book to refer to the component's physical shape or outline. The word "packaging" is used in this book to describe how the component is stored. As an example: Tape and Reel is the packaging. QFP ...
Data sheet acquired from Harris Semiconductor
www.ti.comDevice Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD4060BM96 SOIC D 16 2500 333.2 345.9 28.6 CD4060BNSR SO NS 16 2000 346.0 346.0 33.0
64/128 Mbit Single Operation Voltage
www.issi.comIS25LP032D IS25WP032D Integrated Silicon Solution, Inc.- www.issi.com 2 Rev. A13 09/20/2020 S QUAD I/O QPI DTR INT FEATURES Industry Standard Serial Interface - …
ELECTRONICS INDUSTRIES Generic Requirements for Surface ...
www.ipc.orgIPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard Developed by the Surface Mount Land Patterns Subcommittee (1-13) of the Printed Board Design Committee (1-10) of IPC
64/128 Mbit Single Operation Voltage
www.issi.comIS25LP016D IS25WP016D Integrated Silicon Solution, Inc.- www.issi.com 2 Rev. B12 09/20/2020 S QUAD I/O QPI DTR INT FEATURES Industry Standard Serial Interface - …