Semiconductor and ic package thermal
Found 5 free book(s)
TL431 - Programmable Precision References - ON Semiconductor
www.onsemi.comTL431A, B Series, NCV431A, B Series, SCV431A www.onsemi.com 3 THERMAL CHARACTERISTICS Characteristic Symbol D, LP Suffix Package P Suffix DM Suffix
MT-093: Thermal Design Basics
www.analog.comMT-093. Figure 3: Thermal Rating Curves for AD8017AR Op Amp . With the AD8017AR, the proprietary ADI Thermal Coastline IC package is used, which allows additional power to be dissipated with no increase in the SO-8 package size.
Semiconductor and IC Package Thermal Metrics (Rev. C)
www.ti.com0 10 20 30 40 50 60 70 80 dip 20 cu dip 24 cu qfp 100 cu qfp 120 a-42 qfp 132 a-42 qfp 132 c qfp 160 a-42 qfp 208 cu qfp loc 208 + h.s. qfp 240 cu plcc 20 cu plcc 28 cu plcc 68 cu plcc 84 cu soj
'Thermal Characteristics of Linear and Logic Packages ...
www.ti.com1 Abstract In an effort to standardize integrated-circuit (IC) package thermal-measurement methods, JEDEC has released standards for test-board designs.
PACKAGE QUALIFICATION SUMMARY REPORT
ww1.microchip.comPackage Qualification Summary Report DOCUMENT CONTROL # ML1120110066 Microchip Technology Inc. 4 ASSEMBLY OR PLATING SITE DESIGNATION ORIENT SEMICONDUCTOR ENGINEERING, TAIWAN OSE